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Printed circuit board level reliability test

Printed circuit board test is a service is for companies in need to test, verify or benchmark component reliability. The service can be utilised by companies having their own component design and manufacturing, or optionally by operators buying components for their own use.

Besides verification needs, Toptester BLR (Board Level Reliability) test services could be used also for R&D purposes.

Printed circuit board tests and component reliability tests, in general, are part of manufacturing and design projects. However, when developing new products it is essential to test, verify or compare component reliability. The tests used depend on components and products. Thus, we know what tests your product and components need, including standard industrial tests.

Use printed circuit board level test, and all other reliability tests, before the production stage

Reliability tests should be carried out before the production stage. Therefore because re-designing the product before the production stage is a much cheaper option than waiting for field returns and expensive customer complaints. However, Toptester has a wide testing capacity. We can carry out specific component tests for your product to support in-house testing functions (to benchmark or as an over-flow capacity), or you can utilize our BLR Full-Service Concept.

In Toptester BLR Full-Service Concept you can outsource the whole testing process for our experts (meaning that our own testing facilities are not needed), or optionally support existing in-house testing functions (to benchmark, or as overflow capacity). In Full BLR service, Toptester handles the whole component testing process from board design and manufacturing to component assembly, ending at actual testing of the so-called test-circuit board. Utilizing our Full-Service Concept is a real time-saver for your company’s production process, and enables you to concentrate on your key processes of product design and development.

Printed circuit board test – special tests available, e.g. drop tests up to 30.000g, vibration up to 2000Hz, 4-point bending tests

  • Thermal Cycling (incl. Humidity)
  • Thermal Shock
  • Drop
  • Vibration
  • Four-point bending

Options

  • Failure Analysis
  • Measurements in-situ during tests
  • With Dataloggers or Event detectors

In the video below you’ll see an example of our board level reliability testing:

Please ask for detailed information on measuring capacity by sending us an email: info@toptester.com.

Test Features


STANDARDS

  • Board Level component tests according to IEC, Jedec, MIL 883, AEC or client own specification.
  • Accredited test house for many component-level tests according to Jedec standard

TEST EQUIPMENT

  • 2 pcs Lansmont drop tester
  • 2 pcs Salon Teknopaja drop tester
  • 3 pcs Espec TSA-101S-W thermal shock chambers

Special tests available, e.g. drop tests up to 30.000g, vibration up to 2000Hz, 4-point bending tests

  • Thermal Cycling (incl. Humidity)
  • Thermal Shock
  • Drop
  • Vibration
  • Four-point bending

Options

  • Failure Analysis
  • Measurements in-situ during tests
  • With Dataloggers or Event detectors

Please ask detailed information of measuring capacity by sending us an email: info@toptester.com.